MiEKiNiA Thin sections

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About the samples supplied to the MiĘKiNiA Company:
How to draw up adequate samples specifications How to prepare samples for transportation Formalities and procedures necessary to effectively send samples
About the scope of services rendered by the MiĘKiNiA Company:
Microscopic preparations with use of transmitted light: Thin section from an integrated sample, not covered and not polished of 30 microns thickness Thin section from an integrated sample, covered of 30 microns thickness Thin section from an integrated sample, polished of 30 microns thickness Thin section from an integrated sample, double-polished of 50 microns thickness Thin section from a non-integrated sample: grained, covered of 30 microns thickness Thin section from a non-integrated sample: grained, polished of 30 microns thickness Thin section from a non-integrated sample: powdered, covered of 30 microns thickness Thin section from a non-integrated sample: powdered, polished of 30 microns thickness
Sample processing procedures:
Description of the samples List of the samples Cutting samples Fragile sample strengthening Sample colouring Sample and Section orientating Required dimensioning of sections Section thickness rates Labelling of sections
Duration and phase of procedures:
Anticipated duration of manufacturing sections Phases of performing the order submitted
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